Job Description

Position: Package designer

Total Experience: 5+ Years

Location: SanJose,CA

Work from office / Onsite

We are seeking an experienced packaging designer to develop innovative and cost-effective packaging designs.

JOB DESCRIPTION

• Netlist creation, BGA creation as per the inputs
• Conduct feasibility studies to advise optimum pad layout, interconnect types, and substrate parameters for a specific IC device or application.
• Define substrate stack-ups, routing strategies, and via structures.
• Substrate design experience for RF, digital, high-speed, and mixed signal die
• Excellent understanding of SI/PI requirements for routing HSIO (DDR, SERDES, etc).
• Good experience in UCIE-Advanced and Standard technology, HBM technology.
• Experience in setting design rule checks (DRC) to ensure layouts meet specific manufacturing, Assembly, and design guidelines.
• Experience in optimizing die breakout for signals and creating patterns for High power.
• Strong understanding of HDI substrate technologies, layout design rules, and materials for optimal performance. Verify designs against electrical, thermal, mechanical, and manufacturability requirements.
• Knowledge on different Package types.
• Experience in Wire bond, Flip chip Substrate designs.
• Hands-on experience with Wire bond, Flip chip & advanced packaging technologies (2.5D, 3D, RDL, embedded passives, etc.)
• Strong experience with CoWoS (Chip-on-Wafer-on-Substrate) interposer design and the impact of the substrate design to support CoWoS.
• Knowledge of different OSAT design rules

QUALIFICATION :

• Bachelor's degree in Electronics /Electrical Engineering,
• 3 to 8+ years in IC package design and development.
• Proficiency with Cadence Allegro Package Designer.

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